columbus · Development Of Nondestructive Tests For Structural Adhesive Bonds, Part 3. Mechanical Impedance Technique, "Stub-Meter'

Development Of Nondestructive Tests For Structural Adhesive Bonds, Part 3. Mechanical Impedance Technique, "Stub-Meter'

Title: Development Of Nondestructive Tests For Structural Adhesive Bonds, Part 3. Mechanical Impedance Technique, "Stub-Meter'
Date: 1955
Index Abstract: Online
Photo Quality: Incomplete
Report Number: WADC TR 54-231 Part 3
Corporate Author: Stanford Research Institute
Laboratory: Materials Laboratory
Extent: 31
PB Number: PB111678
Identifier: AD0059300
Access Rights: Notice(s)
Distribution Classification: 2
Contract: AF 33(616)-2035
DoD Project: 7340
DoD Task: 73401
DTIC Record Exists: No
Distribution Change Authority Correspondence: None
Distribution Conflict: Yes
Index Price: $1.00
Report Availability: Not available via Contrails
Date Issued: 1955-04
Abstract: The abstract for this report is either unavailable or has yet to be entered
Provenance: IIT
Type: report
Creator: Arnold, J. S.

Media: http://contrails.iit.edu/DigitalCollection/abstracts/images/PB111678.gif