columbus · Measuring Accuracy In Creep Tests Part 2. Influence Of Thermal Stresses

Measuring Accuracy In Creep Tests Part 2. Influence Of Thermal Stresses

Title: Measuring Accuracy In Creep Tests Part 2. Influence Of Thermal Stresses
Date: 1959
Index Abstract: Limited
Photo Quality: Not Needed
Report Number: WADC TR 59-78 Part 2
Corporate Author: Royal Institute of Technology, Stockholm, Sweden
Laboratory: Materials Laboratory
Extent: 58
PB Number: PB161356
Identifier: AD0231005
Access Rights: OTS
Distribution Classification: 2
Contract: AF 61(052)-05
DoD Project: 7360
DoD Task: 73604
DTIC Record Exists: No
Distribution Change Authority Correspondence: None
Distribution Conflict: Yes
Report Availability: Not available via Contrails
Date Issued: 1959-10
Abstract: The abstract for this report is either unavailable or has yet to be entered
Provenance: IIT
Type: report
Creator: Mellgren, Arne