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Title
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Research On Inorganic High Temperature Adhesives For Metals And Composite Constructions
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Date
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1962
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Index Abstract
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Coming Soon
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Photo Quality
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Incomplete
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Report Number
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WADC TR 59-113 Part 3
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Creator
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Johnston, Ova E.
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Robbins, W. Paul
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Corporate Author
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Aeronca Mfg Corp Middletown OH
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Laboratory
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Directorate of Materials and Processes
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Extent
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241
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Identifier
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AD0282065
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Access Rights
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ASTIA
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Distribution Classification
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1
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Contract
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AF 33(616)-7196
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DoD Project
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7340
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DoD Task
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73401
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DTIC Record Exists
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No
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Distribution Change Authority Correspondence
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AFML LTR
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Abstract
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Research was conducted on high temperature inorganic non-polymeric adhesives for metal to metal bonding, for applications as high as the 2000 to 3000 F range. The following research was accomplished: fabrications and evaluation of experimental inorganic, non-polymeric adhesives; preparation and application of the inorganic adhesives to the metal adherends; improvement of flexibility, toughness, and strength of the adhesive to obtain a highly efficient bond for use in joining the high temperature resistant metals such as 17-7 PH, PH 15-7 Mo, AM-350, Inconel 'X'; processing research for optimum joining of honeycomb sandwich structures with inorganic adhesives; evaluation of bonded honeycomb panels for structural integrity and capability; and refractory metals inorganic adhesive bonded with retention of useful bond strength in the 1800 to 2000 F temperature range.
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The abstract for this report is either unavailable or has yet to be entered
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Report Availability
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Full text available by request
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Date Issued
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1962-05
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Type
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report
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Provenance
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Lockheed Martin Missiles & Fire Control