columbus · Development of Improved Solders for Electronic Reliability

Development of Improved Solders for Electronic Reliability

Title: Development of Improved Solders for Electronic Reliability
Date: 1977
Index Abstract: Not Available
Photo Quality: Incomplete
Report Number: AFML TR 77-93
Creator: Denlinger, M. C.; Korb, R. W.; Lardenoit, V. F.
Corporate Author: Hughes Aircraft Company
Laboratory: Air Force Materials Laboratory
Date Issued: 1977-06
Extent: 109
Identifier: ADA046213
Access Rights: Approved for public release; distribution unlimited
Distribution Classification: 1
Contract: F33615-76-C-5089
DoD Project: 7351 - Metallic Materials
DoD Task: None Given
DTIC Record Exists: No
Distribution Change Authority Correspondence: None
Distribution Conflict: No
Abstract: A higher temperature solder alloy intended for use on polyimide printed wiring boards was developed. The solder shows no evidence of cracking after exposure to 500 temperature cycles between 200 C and -55 C. A comparative test with Sn63 between 125 C and -55 C resulted in cracking after 200 cycles. The alloy (90Pb9Cd1Zn) was the result of selecting, testng and modifying all possible alloy systems that would be suitable for printed wiring board application. The resulting alloy, in addition to providing increased reliability, offers a significant cost reduction over the conventional tin-lead system.
Report Availability: Full text available by request
Provenance: Bearcat
Type: report